Invention Grant
- Patent Title: Semiconductor devices
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Application No.: US17529406Application Date: 2021-11-18
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Publication No.: US12021146B2Publication Date: 2024-06-25
- Inventor: Hongsik Shin , Wonhyuk Lee , Dongkwon Kim , Jinwook Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel, P.A.
- Priority: KR 20210016547 2021.02.05
- Main IPC: H01L29/78
- IPC: H01L29/78 ; H01L27/088 ; H01L29/08

Abstract:
Semiconductor devices may include a substrate, an active region that is on the substrate and extends in a first direction, a gate structure that traverses the active region and extends in a second direction that may be different from the first direction, a source/drain region on the active region adjacent a side of the gate structure, an insulating layer on the substrate, the gate structure and the source/drain region, and a contact structure that is in the insulating layer and is connected to the source/drain region. In the source/drain region, a contact region that is in contact with the contact structure includes first and second side regions spaced apart from each other in the second direction and a central region between the first and second side regions, and at least one of the first and second side regions may include a recess.
Public/Granted literature
- US20220254928A1 SEMICONDUCTOR DEVICES Public/Granted day:2022-08-11
Information query
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