- 专利标题： Resin composition, prepreg, film with resin, metal foil with resin, metal-clad laminate, and wiring board
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申请号： US17256382申请日： 2019-07-09
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公开(公告)号： US12024590B2公开(公告)日： 2024-07-02
- 发明人: Mikio Sato , Yuki Kitai , Yasunori Hoshino , Masashi Koda , Atsushi Wada
- 申请人： PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- 申请人地址： JP Osaka
- 专利权人： PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- 当前专利权人： PANASONIC INTELLECTUAL PROPERTY MANAGEMENT CO., LTD.
- 当前专利权人地址： JP Osaka
- 代理机构： GREENBLUM & BERNSTEIN, P.L.C.
- 优先权： JP 18136062 2018.07.19 JP 19045682 2019.03.13
- 国际申请： PCT/JP2019/027186 2019.07.09
- 国际公布： WO2020/017399A 2020.01.23
- 进入国家日期： 2020-12-28
- 主分类号： C08G65/48
- IPC分类号： C08G65/48 ; C08F290/06 ; C08J5/24 ; H05K1/03
摘要：
An aspect of the present invention is a resin composition containing a compound (A) having at least one group represented by the following Formula (1) in a molecule and an acenaphthylene compound (B).
In Formula (1), n represents 0 to 10, Z represents an arylene group, and R1 to R3 each independently represent a hydrogen atom or an alkyl group.
In Formula (1), n represents 0 to 10, Z represents an arylene group, and R1 to R3 each independently represent a hydrogen atom or an alkyl group.
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