Invention Grant
- Patent Title: Floor panel for forming a floor covering
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Application No.: US18099428Application Date: 2023-01-20
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Publication No.: US12024899B2Publication Date: 2024-07-02
- Inventor: Jan Eddy De Rick
- Applicant: FLOORING INDUSTRIES LIMITED, SARL
- Applicant Address: LU Bertrange
- Assignee: UNILIN, BV
- Current Assignee: UNILIN, BV
- Current Assignee Address: BE Wielsbeke
- Agency: Workman Nydegger
- Main IPC: E04F15/02
- IPC: E04F15/02 ; E04F15/10

Abstract:
A floor panel arranged to be installed according to the fold-down principle, with a first pair and a second pair of edges. The second pair of edges coupling parts are arranged to be coupled to each other by a downward movement with two contact zones at opposite sides of a male part which fits into a female part. The ratio between the horizontal distance between the middle of the first contact zone and the middle of the second contact zone, and the vertical distance between the middle of the first contact zone and the middle of the second contact zone is more than 5, and/or wherein well-defined support points are applied.
Public/Granted literature
- US20230160218A1 FLOOR PANEL FOR FORMING A FLOOR COVERING Public/Granted day:2023-05-25
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