- 专利标题： High temperature superconductor-based interconnect systems with a lowered thermal load for interconnecting cryogenic electronics with non-cryogenic electronics
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申请号： US17327199申请日： 2021-05-21
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公开(公告)号： US12027361B2公开(公告)日： 2024-07-02
- 发明人: Dawson Yee , Craig S. Ranta , Cliff C. Lee , Douglas P. Kelley , Matthew David Turner , David B. Tuckerman
- 申请人： Microsoft Technology Licensing, LLC
- 申请人地址： US WA Redmond
- 专利权人： Microsoft Technology Licensing, LLC
- 当前专利权人： Microsoft Technology Licensing, LLC
- 当前专利权人地址： US WA Redmond
- 代理机构： Singh Law, PLLC
- 代理商 Ranjeev Singh
- 主分类号： H03K19/19
- IPC分类号： H03K19/19 ; H01L23/532 ; H01L27/092 ; H03K19/0185 ; H03K19/195 ; H10N60/12 ; H10N60/80
摘要：
High temperature superconductor (HTS)-based interconnect systems comprising a cable including HTS-based interconnects are described. Each of the HTS-based interconnects includes a first portion extending from a first end towards an intermediate portion and a second portion extending from the intermediate portion to a second end. Each of the HTS-based interconnects includes a substrate layer formed in the first portion, in the intermediate portion, and in the second portion, a high temperature superconductor layer formed in at least a sub-portion of the first portion, in the intermediate portion, and in the second portion, and a metallic layer formed in the first portion and in at least a sub-portion of the intermediate portion. The HTS-based interconnect system includes a thermal load management system configured to maintain the intermediate portion of each of the HTS-based interconnects at a predetermined temperature in a range between a temperature of 60 kelvin and 92 kelvin.
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