A substrate processing apparatus includes a rotation unit supporting and rotating a substrate, a chemical ejection unit ejecting a chemical fluid toward the rotation unit, a chemical recovery unit disposed close to the rotation unit and collecting a chemical fluid scattered from the rotation unit, a first lifting unit coupled to the chemical recovery unit and moving upward and downward the chemical recovery unit relative to the rotation unit, and a first position correction member allowing the chemical recovery unit to be elastically supported by the first lifting unit and changing a relative position of the chemical recovery unit with respect to the lifting unit.