Invention Grant
- Patent Title: Semiconductor module parallel circuit and semiconductor module connection substrate
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Application No.: US17593718Application Date: 2019-03-29
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Publication No.: US12027464B2Publication Date: 2024-07-02
- Inventor: Ryota Hamaguchi , Yasushi Nakayama , Shuichi Nagamitsu
- Applicant: Mitsubishi Electric Corporation
- Applicant Address: JP Tokyo
- Assignee: MITSUBISHI ELECTRIC CORPORATION
- Current Assignee: MITSUBISHI ELECTRIC CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: BUCHANAN INGERSOLL & ROONEY PC
- International Application: PCT/JP2019/014076 2019.03.29
- International Announcement: WO2020/202272A 2020.10.08
- Date entered country: 2021-09-23
- Main IPC: H01L23/64
- IPC: H01L23/64 ; H01L23/538 ; H01L25/07 ; H01L25/10

Abstract:
A semiconductor module parallel circuit includes: a plurality of power semiconductor modules; and a multilayer substrate that interconnects the plurality of power semiconductor modules, each of the power semiconductor modules includes: a power semiconductor switching element; a first signal terminal connected to a gate potential of the power semiconductor switching element; and a second signal terminal connected to a source potential of the power semiconductor switching element, the multilayer substrate includes: an external connection terminal; first signal terminal connection patterns connected to the first signal terminals of the power semiconductor modules; and second signal terminal connection patterns connected to the second signal terminals of the power semiconductor modules, and inductances of gate wiring for the plurality of power semiconductor modules, from the external connection terminal to the first signal terminal connection pattern and from the second signal terminal connection pattern to the external connection terminal are equal to one another.
Public/Granted literature
- US20220173043A1 SEMICONDUCTOR MODULE PARALLEL CIRCUIT AND SEMICONDUCTOR MODULE CONNECTION SUBSTRATE Public/Granted day:2022-06-02
Information query
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