Invention Grant
- Patent Title: Semiconductor device with source/drain pattern including buffer layer
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Application No.: US18201308Application Date: 2023-05-24
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Publication No.: US12027596B2Publication Date: 2024-07-02
- Inventor: Ryong Ha , Dongwoo Kim , Gyeom Kim , Yong Seung Kim , Pankwi Park , Seung Hun Lee
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si Gyeonggi-do
- Agency: Muir Patent Law, PLLC
- Priority: KR 20200005365 2020.01.15
- Main IPC: H01L29/417
- IPC: H01L29/417 ; H01L29/10 ; H01L29/423

Abstract:
A semiconductor device including an active pattern extending in a first direction; a channel pattern on the active pattern and including vertically stacked semiconductor patterns; a source/drain pattern in a recess in the active pattern; a gate electrode on the active pattern and extending in a second direction crossing the first direction, the gate electrode surrounding a top surface, at least one side surface, and a bottom surface of each of the semiconductor patterns; and a gate spacer covering a side surface of the gate electrode and having an opening to the semiconductor patterns, wherein the source/drain pattern includes a buffer layer covering inner sides of the recess, the buffer layer includes an outer side surface and an inner side surface, which are opposite to each other, and each of the outer and inner side surfaces is a curved surface that is convexly curved toward a closest gate electrode.
Public/Granted literature
- US20230326985A1 SEMICONDUCTOR DEVICE Public/Granted day:2023-10-12
Information query
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