Invention Grant
- Patent Title: Semiconductor device and method for manufacturing the same
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Application No.: US17144175Application Date: 2021-01-08
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Publication No.: US12027615B2Publication Date: 2024-07-02
- Inventor: Ronghui Hao , Fu Chen , Chuan He , King Yuen Wong
- Applicant: Innoscience (Suzhou) Technology Co., Ltd.
- Applicant Address: CN Suzhou
- Assignee: INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.
- Current Assignee: INNOSCIENCE (SUZHOU) TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Suzhou
- Agency: JCIPRNET
- Main IPC: H01L29/778
- IPC: H01L29/778 ; H01L29/06 ; H01L29/20 ; H01L29/207 ; H01L29/40 ; H01L29/417 ; H01L29/66 ; H01L29/205 ; H01L29/45

Abstract:
A nitride-based semiconductor device includes a buffer, a first nitride-based semiconductor layer, a shield layer, a second nitride-based semiconductor layer, a pair of S/D electrodes, and a gate electrode. The first nitride-based semiconductor layer is disposed over the buffer and forms a first interface with the buffer. The shield layer includes a first isolation compound and is interposed between the buffer and the first nitride-based semiconductor layer. The first isolation compound has a bandgap greater than a bandgap of the buffer and greater than a bandgap of the first nitride-based semiconductor layer. The second nitride-based semiconductor layer is disposed on the first nitride-based semiconductor layer and has a bandgap less than the bandgap of the first isolation compound and greater than the bandgap of the first nitride-based semiconductor layer. The S/D electrodes and a gate electrode are disposed over the second nitride-based semiconductor layer.
Public/Granted literature
- US20220199822A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME Public/Granted day:2022-06-23
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