- 专利标题： Apparatus for separating semiconductor elements and method for fabricating light-emitting elements using the same
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申请号： US17382825申请日： 2021-07-22
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公开(公告)号： US12033988B2公开(公告)日： 2024-07-09
- 发明人: In Hyuk Kim , Dong Gyun Kim , Jae Hoon Jung , Jin Oh Kwag , Hee Yeon Yoo , Sung Chan Jo , Jeong In Choi , Hye Jung Hong , Jong Hyuk Kang , Dong Eon Lee , Hyun Min Cho
- 申请人： Samsung Display Co., LTD.
- 申请人地址： KR Yongin-si
- 专利权人： SAMSUNG DISPLAY CO., LTD.
- 当前专利权人： SAMSUNG DISPLAY CO., LTD.
- 当前专利权人地址： KR Yongin-si
- 代理机构： KILE PARK REED & HOUTTEMAN PLLC
- 优先权： KR 20200093975 2020.07.28
- 主分类号： H01L25/075
- IPC分类号： H01L25/075 ; H01L21/68 ; H01L21/78 ; H01L33/00
摘要：
An apparatus includes a base including a receiving portion that receives a substrate on which semiconductor elements are disposed; and at least one ultrasonic generator that generates and applies ultrasonic waves to the substrate placed in the base.
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