Invention Grant
- Patent Title: Electronic device including microphone module
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Application No.: US17696499Application Date: 2022-03-16
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Publication No.: US12035091B2Publication Date: 2024-07-09
- Inventor: Seunga Lee , Yongwook Park , Yongbum Jeung , Jaewon Kim , Yunhee Nam , Seungnyun Kim , Yongsang Yun
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Jefferson IP Law, LLP
- Priority: KR 20210075678 2021.06.10
- Main IPC: H04R1/08
- IPC: H04R1/08 ; H04R1/10 ; H04R1/28

Abstract:
An electronic device is provided. The electronic device includes a housing including a microphone hole, a support member connected to the housing, wherein the support member includes an antenna structure facing at least a part of the housing and a microphone chamber configured to receive external sound of the electronic device from the microphone hole, and a microphone module connected to the support member and configured to receive external sound of the electronic device through the microphone hole and the microphone chamber.
Public/Granted literature
- US20220400326A1 ELECTRONIC DEVICE INCLUDING MICROPHONE MODULE Public/Granted day:2022-12-15
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