Invention Grant
- Patent Title: Apparatus and method for joining of carbide ceramics
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Application No.: US17164474Application Date: 2021-02-01
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Publication No.: US12036695B2Publication Date: 2024-07-16
- Inventor: Jung-Kun Lee , Ian Nettleship , Ryan W. Read
- Applicant: University of Pittsburgh—Of The Commonwealth System of Higher Education
- Applicant Address: US PA Pittsburgh
- Assignee: University of Pittsburgh—Of The Commonwealth System of Higher Education
- Current Assignee: University of Pittsburgh—Of The Commonwealth System of Higher Education
- Current Assignee Address: US PA Pittsburgh
- Agency: Clark Hill PLC
- Agent Paul D. Bangor, Jr.
- Main IPC: C04B35/571
- IPC: C04B35/571 ; B28B1/00 ; B33Y10/00 ; B33Y70/10 ; C04B35/56 ; C04B35/565 ; C04B35/632 ; C04B35/64 ; C04B37/00
Abstract:
A bonding tape for joining carbide ceramic structures, wherein the bonding tape comprises: a mixture comprising carbide ceramic particles, preceramic polymer liquid, fine carbon particles and metal nanoparticles that form a eutectic liquid at temperatures below 1400° C.
Public/Granted literature
- US20210316473A1 APPARATUS AND METHOD FOR JOINING OF CARBIDE CERAMICS Public/Granted day:2021-10-14
Information query
IPC分类:
