- 专利标题: Polyamide-imide film and method for producing same
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申请号: US17862476申请日: 2022-07-12
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公开(公告)号: US12037473B2公开(公告)日: 2024-07-16
- 发明人: Dae Seong Oh , Dawoo Jeong , Sunhwan Kim , Jin Woo Lee , Dong Jin Lim , Kyungeun Oh
- 申请人: SK microworks Co., Ltd.
- 申请人地址: KR Gyeonggi-do
- 专利权人: SK MICROWORKS CO., LTD.
- 当前专利权人: SK MICROWORKS CO., LTD.
- 当前专利权人地址: KR Gyeonggi-Do
- 代理机构: IP & T GROUP LLP
- 优先权: KR 20170017550 2017.02.08 KR 20170122035 2017.09.21
- 分案原申请号: US16477664
- 主分类号: C08G73/10
- IPC分类号: C08G73/10 ; B29C39/24 ; B29C39/38 ; B29C39/42 ; B29C39/44 ; C08G73/14 ; C08J5/18 ; C08L79/08 ; B29C41/00 ; B29K77/00 ; B29K105/00
摘要:
An embodiment can provide a polyamide-imide film and a method for producing same, the film comprising a polyamide-imide polymer formed by polymerizing an aromatic diamine compound, an aromatic dianhydride compound and a dicarbonyl compound, wherein, in an XRD graph with a section in which 2θ=8° to 32° as a baseline, the film shows a peak area of 50% or above around 2θ=23° with respect to a peak area seen around 2θ=15°.
公开/授权文献
- US20220356317A1 POLYAMIDE-IMIDE FILM AND METHOD FOR PRODUCING SAME 公开/授权日:2022-11-10
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