A circuit protection device including a positive temperature coefficient (PTC) device and a backup fuse electrically connected in series with one another, the backup fuse comprising a quantity of solder disposed on a dielectric chip and having a melting temperature that is higher than a trip temperature of the PTC device, wherein the a surface of the dielectric chip exhibits a de-wetting characteristic relative to the solder such that, when the solder is melted, the solder draws away from the surface to create a galvanic opening in the backup fuse.