- 专利标题： Method of manufacturing light-emitting device, method of manufacturing light emitting module, and light-emitting device
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申请号： US17551143申请日： 2021-12-14
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公开(公告)号： US12044399B2公开(公告)日： 2024-07-23
- 发明人: Isamu Niki
- 申请人： NICHIA CORPORATION
- 申请人地址： JP Anan
- 专利权人： NICHIA CORPORATION
- 当前专利权人： NICHIA CORPORATION
- 当前专利权人地址： JP Anan
- 代理机构： Global IP Counselors, LLP
- 优先权： JP 18184515 2018.09.28
- 分案原申请号： US16585502 2019.09.27
- 主分类号： F21V9/35
- IPC分类号： F21V9/35 ; F21V9/30 ; F21V19/00 ; F21Y115/30 ; H01S5/00 ; H05K1/18 ; H05K3/30
摘要：
A method of manufacturing a light-emitting device includes: providing a light source including a first substrate and a light-emitting element coupled to the first substrate; and after the providing of the light source, forming one or more positioning holes in the first substrate at locations spaced apart from a light-emitting part of the light source by predetermined distances in a top plan view.
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