Invention Grant
- Patent Title: Light-emitting substrate, method of manufacturing light-emitting substrate, and display device
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Application No.: US17434835Application Date: 2021-04-08
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Publication No.: US12046591B2Publication Date: 2024-07-23
- Inventor: Xuan Liang , Meili Wang , Fei Wang , Xue Dong , Qi Qi
- Applicant: BOE Technology Group Co., Ltd.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: WHDA, LLP
- Priority: CN 2010395225.7 2020.05.11
- International Application: PCT/CN2021/085977 2021.04.08
- International Announcement: WO2021/227717A 2021.11.18
- Date entered country: 2021-08-30
- Main IPC: H01L23/00
- IPC: H01L23/00 ; H01L25/16

Abstract:
A light-emitting substrate, a method of manufacturing a light-emitting substrate, and a display device are provided. The light-emitting substrate includes: a first substrate, wherein the first substrate includes a first base substrate, a light-emitting diode arranged on the first base substrate, and a first conductive pad arranged on the first base substrate; a second substrate arranged opposite to the first substrate, wherein the second substrate includes a second base substrate, and a second conductive pad arranged on the second base substrate; and a bonding wire structure including a bonding wire, wherein the first conductive pad is located on a surface of the first substrate away from the second substrate, the second conductive pad is located on a surface of the second substrate away from the first substrate, and the bonding wire is configured to electrically connect the first conductive pad and the second conductive pad.
Public/Granted literature
- US20220320056A1 LIGHT-EMITTING SUBSTRATE, METHOD OF MANUFACTURING LIGHT-EMITTING SUBSTRATE, AND DISPLAY DEVICE Public/Granted day:2022-10-06
Information query
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