- 专利标题： Electronic device comprising surface-mount device type dipoles, and corresponding assembly method
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申请号： US17193702申请日： 2021-03-05
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公开(公告)号： US12048099B2公开(公告)日： 2024-07-23
- 发明人: Pierino Calascibetta
- 申请人： STMicroelectronics (Grenoble 2) SAS
- 申请人地址： FR Grenoble
- 专利权人： STMicroelectronics (Grenoble 2) SAS
- 当前专利权人： STMicroelectronics (Grenoble 2) SAS
- 当前专利权人地址： FR Grenoble
- 代理机构： Crowe & Dunlevy LLC
- 优先权： FR 02455 2020.03.12
- 主分类号： H05K1/18
- IPC分类号： H05K1/18 ; H01Q1/22 ; H01Q9/16 ; H05K1/11
摘要：
A base substrate has a thickness between two faces. The base substrate includes at least one hole extending in a thickness of the base substrate perpendicular to one of the two face. At least one dipole of a surface-mount device type is housed in the at least one hole of the base substrate.
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