Invention Grant
- Patent Title: Radio-frequency module and communication device
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Application No.: US17540264Application Date: 2021-12-02
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Publication No.: US12052001B2Publication Date: 2024-07-30
- Inventor: Takayuki Shinozaki , Shigeru Tsuchida
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Nagaokakyo
- Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee: MURATA MANUFACTURING CO., LTD.
- Current Assignee Address: JP Nagaokakyo
- Agency: XSENSUS LLP
- Priority: JP 19127756 2019.07.09 JP 20076279 2020.04.22
- Main IPC: H04B1/04
- IPC: H04B1/04 ; H01Q1/22 ; H01Q1/24 ; H01Q1/38 ; H03F1/56 ; H03F3/24 ; H04B1/00 ; H04B1/40

Abstract:
A radio-frequency module includes a mounting substrate, a power amplifier, and a controller. The mounting substrate has first and second main surfaces opposing each other. The power amplifier is disposed on one of the first and second main surfaces (the first main surface, for example) of the mounting substrate. The controller is disposed on the other one of the first and second main surfaces (the second main surface, for example) of the mounting substrate. The controller controls the power amplifier.
Public/Granted literature
- US20220094308A1 RADIO-FREQUENCY MODULE AND COMMUNICATION DEVICE Public/Granted day:2022-03-24
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