Invention Grant
- Patent Title: Support, bonding device including support, and method of manufacturing display device using the same
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Application No.: US17188744Application Date: 2021-03-01
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Publication No.: US12052906B2Publication Date: 2024-07-30
- Inventor: Jungkyu Lee , Youngsu Kim , Jongdeok Park , Jaesuk Yoo , Jeong-Seop Choi
- Applicant: Samsung Display Co., LTD.
- Applicant Address: KR Yongin-si
- Assignee: SAMSUNG DISPLAY CO., LTD.
- Current Assignee: SAMSUNG DISPLAY CO., LTD.
- Current Assignee Address: KR Yongin-si
- Agency: KILE PARK REED & HOUTTEMAN PLLC
- Priority: KR 20200068125 2020.06.05
- Main IPC: H10K71/00
- IPC: H10K71/00 ; B29C65/00 ; B29L31/34
Abstract:
A bonding device includes a first panel support, a second panel support disposed below the first panel support, a diaphragm disposed on and extending along the first panel support, the diaphragm being disposed between the first panel support and the second panel support, and a window fixing chuck disposed on the diaphragm, the window fixing chuck including a groove facing the diaphragm. A through-hole extends from the second panel support to the first panel support, and the diaphragm is disposed on the through-hole.
Public/Granted literature
- US20210384479A1 SUPPORT, BONDING DEVICE INCLUDING SUPPORT, AND METHOD OF MANUFACTURING DISPLAY DEVICE USING THE SAME Public/Granted day:2021-12-09
Information query
