- 专利标题: Leveling system for lift device
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申请号: US17078895申请日: 2020-10-23
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公开(公告)号: US12054370B2公开(公告)日: 2024-08-06
- 发明人: Eric Hackenberg , Jihong Hao , Harish Sivasubramanian , Marcel Amsallen
- 申请人: Oshkosh Corporation
- 申请人地址: US WI Oshkosh
- 专利权人: Oshkosh Corporation
- 当前专利权人: Oshkosh Corporation
- 当前专利权人地址: US WI Oshkosh
- 代理机构: Foley & Lardner LLP
- 主分类号: B66F13/00
- IPC分类号: B66F13/00 ; B60G17/0165 ; B60K7/00 ; B62D7/14 ; B62D21/18 ; B66F11/04 ; B66F17/00
摘要:
A vehicle includes a chassis, a first actuator coupled to the chassis, a second actuator coupled to the chassis, a third actuator coupled to the chassis, a fourth actuator coupled to the chassis, and a fluid circuit. The fluid circuit is configured to facilitate selectively fluidly coupling the first actuator, the second actuator, the third actuator, and the fourth actuator in a plurality of different configuration. In each of the plurality of different configurations, two of the first actuator, the second actuator, the third actuator, and the fourth actuator are fluidly coupled together while the other two of the first actuator, the second actuator, the third actuator, and the fourth actuator are fluidly decoupled.
公开/授权文献
- US20210039934A1 LEVELING SYSTEM FOR LIFT DEVICE 公开/授权日:2021-02-11
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