Invention Grant
- Patent Title: Pattern analysis system and method of manufacturing semiconductor device using the same
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Application No.: US17547503Application Date: 2021-12-10
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Publication No.: US12062164B2Publication Date: 2024-08-13
- Inventor: Min-Cheol Kang , Dong Hoon Kuk
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: F. CHAU & ASSOCIATES, LLC
- Priority: KR 20200187014 2020.12.30
- Main IPC: G06T7/00
- IPC: G06T7/00 ; G06T5/70 ; G06T7/13 ; G06T7/30

Abstract:
A method of manufacturing a semiconductor device that includes providing a substrate having a pattern formed thereon. A scanning electron microscope (SEM) image is generated that includes a boundary image showing an edge of the pattern. A blended image is generated by performing at least one blending operation on the SEM image and a background image aligned with the boundary image. Contour data is generated by binarizing the blended image on a basis of a threshold value. The threshold value is determined by a critical dimension of the pattern.
Public/Granted literature
- US20220207699A1 PATTERN ANALYSIS SYSTEM AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE USING THE SAME Public/Granted day:2022-06-30
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