发明授权
- 专利标题: HEMT transistor with adjusted gate-source distance, and manufacturing method thereof
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申请号: US17703779申请日: 2022-03-24
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公开(公告)号: US12062715B2公开(公告)日: 2024-08-13
- 发明人: Ferdinando Iucolano
- 申请人: STMICROELECTRONICS S.R.L.
- 申请人地址: IT Agrate Brianza
- 专利权人: STMICROELECTRONICS S.R.L.
- 当前专利权人: STMICROELECTRONICS S.R.L.
- 当前专利权人地址: IT Agrate Brianza
- 代理机构: Seed IP Law Group LLP
- 优先权: IT 2018000010448 2018.11.20
- 分案原申请号: US16688974 2019.11.19
- 主分类号: H01L29/66
- IPC分类号: H01L29/66 ; H01L29/40 ; H01L29/778 ; H01L29/78
摘要:
An HEMT includes: a heterostructure; a dielectric layer on the heterostructure; a gate electrode, which extends throughout the thickness of the dielectric layer; a source electrode; and a drain electrode. The dielectric layer extends between the gate electrode and the drain electrode and is absent between the gate electrode and the source electrode. In this way, the distance between the gate electrode and the source electrode can be designed in the absence of constraints due to a field plate that extends towards the source electrode.
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