Invention Grant
- Patent Title: Electrical connection for an AIMD utilizing an anisotropic conductive layer
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Application No.: US17165500Application Date: 2021-02-02
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Publication No.: US12064639B2Publication Date: 2024-08-20
- Inventor: Robert A. Stevenson , Christine A. Frysz , Keith W. Seitz , Brian P Hohl , Marc Gregory Martino
- Applicant: Greatbatch Ltd.
- Applicant Address: US NY Clarence
- Assignee: Greatbatch Ltd.
- Current Assignee: Greatbatch Ltd.
- Current Assignee Address: US NY Clarence
- Agent Michael F. Scalise
- Main IPC: A61N1/375
- IPC: A61N1/375 ; H01G4/008 ; H01G4/12 ; H01G4/236 ; H01G4/35

Abstract:
A feedthrough for an AIMD includes a ferrule with an insulator hermetically sealing a ferrule opening, both cooperatively separating a body fluid side from a device side. A circuit board disposed adjacent to the insulator device side has a ground plate or ground trace electrically connected to a circuit board ground conductive pathway disposed in a circuit board ground via hole. An anisotropic conductive layer disposed between the circuit board and the insulator device side has an electrically insulative matrix supporting a plurality of electrically conductive particles. The anisotropic conductive layer has a first thickness where at least one first electrically conductive particle is longitudinally aligned and in electrical contact with the ferrule and the circuit board ground conductive pathway electrically connected to the at least one circuit board ground plate or ground trace. The anisotropic conductive layer has a second, greater thickness where the ferrule and the circuit board ground conductive pathway are not longitudinally aligned, and no electrically conductive particles are in electrical contact with the ferrule and the circuit board ground conductive pathway.
Public/Granted literature
- US20210154483A1 Electrical Connection For An AIMD Utilizing An Anisotropic Conductive Layer Public/Granted day:2021-05-27
Information query
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