- 专利标题: Semiconductor device and method for manufacturing same
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申请号: US17040631申请日: 2018-03-26
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公开(公告)号: US12068411B2公开(公告)日: 2024-08-20
- 发明人: Toshiharu Marui , Tetsuya Hayashi , Keiichiro Numakura , Wei Ni , Ryota Tanaka , Keisuke Takemoto
- 申请人: NISSAN MOTOR CO., LTD. , RENAULT S.A.S.
- 申请人地址: JP Yokohama
- 专利权人: NISSAN MOTOR CO., LTD.,RENAULT S. A. S.
- 当前专利权人: NISSAN MOTOR CO., LTD.,RENAULT S. A. S.
- 当前专利权人地址: JP Yokohama; FR Boulogne-Billancourt
- 代理机构: Foley & Lardner LLP
- 国际申请: PCT/IB2018/000548 2018.03.26
- 国际公布: WO2019/186224A 2019.10.03
- 进入国家日期: 2020-09-23
- 主分类号: H01L29/78
- IPC分类号: H01L29/78 ; H01L29/06 ; H01L29/417 ; H01L29/66
摘要:
A semiconductor device includes: a substrate having a groove formed on a main surface; a drift region of a first conductivity type, the drift region having a portion disposed at a bottom part; a well region of a second conductivity type, the well region being disposed in one sidewall to be connected to the drift region; a first semiconductor region of the first conductivity type, the first semiconductor region being disposed on a surface of the well region in the sidewall to be away from the drift region; a second semiconductor region of the first conductivity type, the second semiconductor region being disposed to be opposed to the well region via the drift region; and a gate electrode opposed to the well region, the gate electrode being disposed in a gate trench that has an opening extending over the upper surfaces of the well region and the first semiconductor region.
公开/授权文献
- US20210367070A1 SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING SAME 公开/授权日:2021-11-25
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