- Patent Title: Semiconductor devices and methods of forming semiconductor devices
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Application No.: US18124043Application Date: 2023-03-21
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Publication No.: US12069849B2Publication Date: 2024-08-20
- Inventor: Daeik Kim , Bong-Soo Kim , Jemin Park , Taejin Park , Yoosang Hwang
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel, P.A.
- Priority: KR 20160055607 2016.05.04
- Main IPC: H10B12/00
- IPC: H10B12/00 ; H01L21/3213 ; H01L21/768 ; H01L21/8234 ; H01L29/66

Abstract:
Semiconductor devices are provided. A semiconductor device includes a substrate. The semiconductor device includes a stack structure on the substrate. The stack structure includes a first insulating material and a second insulating material that is on the first insulating material. The semiconductor device includes a spacer that extends from a sidewall of the first insulating material of the stack structure to a portion of a sidewall of the second insulating material of the stack structure. Moreover, the semiconductor device includes a conductive line that is on the spacer. Methods of forming semiconductor devices are also provided.
Public/Granted literature
- US20230225114A1 SEMICONDUCTOR DEVICES AND METHODS OF FORMING SEMICONDUCTOR DEVICES Public/Granted day:2023-07-13
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