- 专利标题： Curable resin composition, use thereof, and production method thereof
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申请号： US17127356申请日： 2020-12-18
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公开(公告)号： US12071572B2公开(公告)日： 2024-08-27
- 发明人: Mitsuteru Mutsuda , Hirofumi Iguchi , Toshiaki Nakamura
- 申请人： Daicel-Evonik Ltd.
- 申请人地址： JP Tokyo
- 专利权人： DAICEL-EVONIK LTD.
- 当前专利权人： DAICEL-EVONIK LTD.
- 当前专利权人地址： JP Tokyo
- 代理机构： Birch, Stewart, Kolasch & Birch, LLP
- 优先权： JP 20006351 2020.01.17
- 主分类号： C09J7/38
- IPC分类号： C09J7/38 ; C08L77/06 ; C09J7/28
摘要：
[Object]
The present invention provides a curable resin composition useful for imparting high durability and adhesion to a substrate such as a metal.
[Solution]
A curable resin composition is prepared by combining a polyamide-based resin (A) having an amino group, a blocked polyisocyanate (B), and an epoxy compound (C). The polyamide-based resin (A) contains a polyamide-based resin (A1) having a melting point of 170° C. or higher and a polyamide-based resin (A2) having a melting point of 150° C. or lower. The mass ratio of the polyamide-based resin (A1) and the polyamide-based resin (A2) is, in the form of the former/the latter, from 65/35 to 35/65.
The present invention provides a curable resin composition useful for imparting high durability and adhesion to a substrate such as a metal.
[Solution]
A curable resin composition is prepared by combining a polyamide-based resin (A) having an amino group, a blocked polyisocyanate (B), and an epoxy compound (C). The polyamide-based resin (A) contains a polyamide-based resin (A1) having a melting point of 170° C. or higher and a polyamide-based resin (A2) having a melting point of 150° C. or lower. The mass ratio of the polyamide-based resin (A1) and the polyamide-based resin (A2) is, in the form of the former/the latter, from 65/35 to 35/65.
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