Invention Grant
- Patent Title: Electroplating with a polycarboxylate ether supressor
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Application No.: US17909030Application Date: 2021-03-03
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Publication No.: US12071700B2Publication Date: 2024-08-27
- Inventor: Tobias Urban , Paul Klingelhoefer , Sophie Maitro-Vogel , Yvonne Schriefers , Frank Richter , Manfred Bichler
- Applicant: BASF SE
- Applicant Address: DE Ludwigshafen
- Assignee: BASF SE
- Current Assignee: BASF SE
- Current Assignee Address: DE Ludwigshafen
- Agency: ArentFox Schiff LLP
- Priority: EP 161357 2020.03.06 EP 179012 2020.06.09
- International Application: PCT/EP2021/055364 2021.03.03
- International Announcement: WO2021/175935A 2021.09.10
- Date entered country: 2022-09-02
- Main IPC: C25D3/02
- IPC: C25D3/02 ; C25D3/38 ; C25D5/00 ; C25D21/12
Abstract:
The present invention relates to a process for depositing a metal layer on a substrate by contacting the substrate with a metal plating bath comprising a metal ion source and a suppressor, and applying a current density to the substrate, where the suppressor is a polycarboxylate ether as described below. The invention further relates to a metal plating bath comprising a metal ion source and the suppressor which is a polycarboxylate ether; and to a use of the polycarboxylate ether in a metal plating bath for depositing a metal layer on a substrate.
Public/Granted literature
- US20230091747A1 ELECTROPLATING WITH A POLYCARBOXYLATE ETHER SUPRESSOR Public/Granted day:2023-03-23
Information query
