Invention Grant
- Patent Title: Use of bonding resin
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Application No.: US17610856Application Date: 2020-05-13
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Publication No.: US12077682B2Publication Date: 2024-09-03
- Inventor: Ben Nasli Bakir , Ashar Zafar , Jesper Ekström
- Applicant: Stora Enso OYJ
- Applicant Address: FI Helsinki
- Assignee: Stora Enso OYJ
- Current Assignee: Stora Enso OYJ
- Current Assignee Address: FI Helsinki
- Agency: Greer, Burns & Crain, Ltd.
- Priority: SE 505742 2019.05.15
- International Application: PCT/IB2020/054503 2020.05.13
- International Announcement: WO2020/230034A 2020.11.19
- Date entered country: 2021-11-12
- Main IPC: C09J103/02
- IPC: C09J103/02 ; B27D1/04 ; B32B7/12 ; B32B21/04 ; C09J105/06 ; C09J105/08 ; C09J163/00 ; C09J189/00

Abstract:
The present invention relates to the use of a bonding resin prepared by providing an aqueous solution comprising at least one biobased product selected from tannin, starch, soy protein, glycerol, chitin, pectin, dextrose or other carbohydrates, or a mixture thereof and mixing the aqueous solution with one or more of certain crosslinkers such as ethers, and optionally one or more additives. The bonding resin is used in the manufacture of laminates, mineral wool insulation or wood products, such as engineered wood products, such as plywood, oriented strandboard (OSB), laminated veneer lumber (LVL), medium density fiberboards (MDF), high density fiberboards (HDF) or particle boards. Preferably, the bonding resin does not comprise lignin.
Public/Granted literature
- US20220259466A1 USE OF BONDING RESIN Public/Granted day:2022-08-18
Information query
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