发明授权
- 专利标题: Vacuum processing apparatus and method for controlling vacuum processing apparatus
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申请号: US17444680申请日: 2021-08-09
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公开(公告)号: US12080523B2公开(公告)日: 2024-09-03
- 发明人: Kiyoshi Mori
- 申请人: Tokyo Electron Limited
- 申请人地址: JP Tokyo
- 专利权人: Tokyo Electron Limited
- 当前专利权人: Tokyo Electron Limited
- 当前专利权人地址: JP Tokyo
- 代理机构: Armstrong Teasdale LLP
- 优先权: JP 20137294 2020.08.17
- 主分类号: H01J37/32
- IPC分类号: H01J37/32 ; H01J37/244
摘要:
The present disclosure relates to a vacuum processing apparatus. The vacuum processing apparatus includes a processing container capable of maintaining an inside thereof in a vacuum atmosphere, a stage provided in the processing container and on which a substrate is placed, a support member passing through an opening formed at a bottom of the processing container to support the stage from below, a holder part located outside the processing container, a flange part arranged around the opening on the outside of the processing container, and a sealing part configured to be expandable and contractible and provided inside the spherical bearing along the circumferential direction of the opening so as to airtightly seal at least a space between the flange part and the holder part.
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