Invention Grant
- Patent Title: Resistivity engineered substrate for RF common-mode suppression
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Application No.: US18094205Application Date: 2023-01-06
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Publication No.: US12081268B2Publication Date: 2024-09-03
- Inventor: Long Chen , Leonard Jan-Peter Ketelsen
- Applicant: ACACIA COMMUNICATIONS, INC.
- Applicant Address: US MA Maynard
- Assignee: ACACIA TECHNOLOGY, INC.
- Current Assignee: ACACIA TECHNOLOGY, INC.
- Current Assignee Address: US CA San Jose
- Agency: K&L Gates LLP
- Main IPC: H01S5/026
- IPC: H01S5/026 ; G02B6/12 ; G02B6/13 ; H04B10/032 ; H04B10/25 ; H04B10/50 ; H04J14/02

Abstract:
Aspects of the present disclosure are directed to a photonic integrated circuit (PIC) having a resistivity-engineered substrate to suppress radio-frequency (RF) common-mode signals. In some embodiments, a semiconductor substrate is provided that comprises two portions having different levels of resistivity to provide both suppression of common mode signals, and reduction of RF absorption loss for non-common mode RF signals. In such embodiments, a bottom portion of the semiconductor substrate has a low resistivity to suppress common mode via RF absorption, while a top portion of the semiconductor substrate that is adjacent to conductors in the IC has a high resistivity to reduce RF loss.
Public/Granted literature
- US20230155683A1 RESISTIVITY ENGINEERED SUBSTRATE FOR RF COMMON-MODE SUPPRESSION Public/Granted day:2023-05-18
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