- 专利标题: Method for manufacturing memory and memory
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申请号: US17457819申请日: 2021-12-06
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公开(公告)号: US12082393B2公开(公告)日: 2024-09-03
- 发明人: Qiang Wan , Jun Xia , Kangshu Zhan , Sen Li , Tao Liu , Penghui Xu
- 申请人: CHANGXIN MEMORY TECHNOLOGIES, INC.
- 申请人地址: CN Hefei
- 专利权人: CHANGXIN MEMORY TECHNOLOGIES, INC.
- 当前专利权人: CHANGXIN MEMORY TECHNOLOGIES, INC.
- 当前专利权人地址: CN Hefei
- 代理机构: Kilpatrick Townsend & Stockton LLP
- 优先权: CN 2110160895.5 2021.02.05
- 主分类号: H01L27/108
- IPC分类号: H01L27/108 ; H10B12/00
摘要:
A method for manufacturing a memory and a memory is provided. The method for manufacturing a memory includes: providing a substrate; stacking an electrode support structure, a protective layer and a first mask layer in sequence on the substrate; patterning the first mask layer on an array region, and etching the protective layer, the electrode support structure and the substrate by using the patterned first mask layer as a mask, to form capacitor holes penetrating the protective layer and the electrode support structure and extending into the substrate; removing the first mask layer; and forming a first electrode layer on side walls and bottom walls of the capacitor holes, a top surface of the first electrode layer being flush with a top surface of the electrode support structure.
公开/授权文献
- US20220254782A1 METHOD FOR MANUFACTURING MEMORY AND MEMORY 公开/授权日:2022-08-11
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