- 专利标题： Polyamide molding compound with low dielectric loss factor
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申请号： US17348481申请日： 2021-06-15
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公开(公告)号： US12084573B2公开(公告)日： 2024-09-10
- 发明人: Doris Abt , Georg Stoeppelmann , Botho Hoffmann
- 申请人： EMS-CHEMIE AG
- 申请人地址： CH Domat/Ems
- 专利权人： EMS-CHEMIE AG
- 当前专利权人： EMS-CHEMIE AG
- 当前专利权人地址： CH Domat/Ems
- 代理机构： Dennemeyer & Associates LLC
- 优先权： CH 74420 2020.06.22
- 主分类号： C08L71/12
- IPC分类号： C08L71/12 ; C08K3/40 ; C08K7/14
摘要：
The present invention relates to a thermoplastic molding composition comprising:
A mixture of at least one polyamide A1, at least one polyphenylene ether A2 and optionally a compatibilizer A3 and optionally an olefinic and/or vinylaromatic polymer A4;
B 10 to 60% by weight of glass filler, the glass composition of which comprises at least 10% by weight of boron oxide and at most 15% by weight for the sum of magnesium oxide and calcium oxide;
C 1 to 8% by weight of LDS additive;
D 0 to 5% by weight of additives other than components A, B and C;
wherein 80 to 100% by weight of mixture A consists of a mixture M of components A1, A2 and A3 and 0 to 20% by weight of component A4, in each case based on the sum of components M and A4, and wherein the sum of components M and A4 gives 100% by weight of mixture A, and wherein 36 to 92% by weight of mixture M is of component A2, from 8 to 60% by weight of component A1 and from 0 to 4% by weight of component A3, based in each case on the sum of components A1 to A3, and the sum of components A1 to A3 being 100% by weight of the mixture M, and the sum of components A to D being 100% by weight of the molding composition.
A mixture of at least one polyamide A1, at least one polyphenylene ether A2 and optionally a compatibilizer A3 and optionally an olefinic and/or vinylaromatic polymer A4;
B 10 to 60% by weight of glass filler, the glass composition of which comprises at least 10% by weight of boron oxide and at most 15% by weight for the sum of magnesium oxide and calcium oxide;
C 1 to 8% by weight of LDS additive;
D 0 to 5% by weight of additives other than components A, B and C;
wherein 80 to 100% by weight of mixture A consists of a mixture M of components A1, A2 and A3 and 0 to 20% by weight of component A4, in each case based on the sum of components M and A4, and wherein the sum of components M and A4 gives 100% by weight of mixture A, and wherein 36 to 92% by weight of mixture M is of component A2, from 8 to 60% by weight of component A1 and from 0 to 4% by weight of component A3, based in each case on the sum of components A1 to A3, and the sum of components A1 to A3 being 100% by weight of the mixture M, and the sum of components A to D being 100% by weight of the molding composition.
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