A packaging structure and a packaging method of edge couplers and a fiber array are provided. The packaging structure includes a silicon substrate, an edge coupler, and a fiber array. Multiple edge couplers are arranged in a main body portion of the silicon substrate, and an end of the edge coupler extends to a step groove of the silicon substrate. At least a part of the cover of the fiber array is accommodated in the step groove. Multiple fibers in the fiber array correspondingly pass through multiple lead channels of the cover and are then coupled with the edge couplers in the step groove. The edge couplers butt the fibers in the fiber array. The cover is moved until a part of the cover is accommodated in the step groove, so that the fibers can be aligned with the edge couplers in the step groove.