Invention Grant
- Patent Title: Image sensor and manufacturing process thereof
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Application No.: US17453013Application Date: 2021-11-01
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Publication No.: US12087785B2Publication Date: 2024-09-10
- Inventor: Hoemin Jeong , Seungjoo Nah , Heegeun Jeong , Wonmo Chun
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: F. CHAU & ASSOCIATES, LLC
- Priority: KR 20200159232 2020.11.24
- Main IPC: H01L27/146
- IPC: H01L27/146

Abstract:
An image sensor includes: a substrate including a plurality of first and second pixels; a light blocking pattern providing a plurality of first spaces respectively disposed on the first pixels and at least one second space disposed on the plurality of second pixels; a plurality of color filters respectively disposed in the plurality of first spaces; and a microlens layer including a plurality of first microlenses respectively disposed on the plurality of color filters, at least one filling portion disposed in the at least one second space, and at least one second microlens disposed on the at least one filling portion, wherein the microlenses are disposed at the same height as each other, and wherein the at least one filling portion and the at least one second microlens comprise an integrated structure without an interface between the at least one filling portion and the at least one second microlens.
Public/Granted literature
- US20220165766A1 IMAGE SENSOR AND MANUFACTURING PROCESS THEREOF Public/Granted day:2022-05-26
Information query
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