Invention Grant
- Patent Title: Determination of substrate layer thickness with polishing pad wear compensation
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Application No.: US18365527Application Date: 2023-08-04
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Publication No.: US12090599B2Publication Date: 2024-09-17
- Inventor: Kun Xu , Benjamin Cherian , Jun Qian , Kiran Lall Shrestha
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Fish & Richardson P.C.
- The original application number of the division: US17344779 2021.06.10
- Main IPC: B24B37/00
- IPC: B24B37/00 ; B24B37/013 ; G05B19/418 ; G06N3/045 ; G06N3/08 ; H01L23/00
Abstract:
A method of training a neural network includes obtaining two ground truth thickness profiles a test substrate, obtaining two thickness profiles for the test substrate as measured by an in-situ monitoring system while the test substrate is on polishing pads of different thicknesses, generating an estimated thickness profile for another thickness value that is between the two thickness values by interpolating between the two profiles, and training a neural network using the estimated thickness profile.
Public/Granted literature
- US20230381912A1 DETERMINATION OF SUBSTRATE LAYER THICKNESS WITH POLISHING PAD WEAR COMPENSATION Public/Granted day:2023-11-30
Information query
