Invention Grant
- Patent Title: 3D memory structure and circuit
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Application No.: US17694313Application Date: 2022-03-14
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Publication No.: US12094569B2Publication Date: 2024-09-17
- Inventor: Chung-Kuang Chen , Chun-Hsiung Hung
- Applicant: MACRONIX International Co., Ltd.
- Applicant Address: TW Hsinchu
- Assignee: MACRONIX International Co., Ltd.
- Current Assignee: MACRONIX International Co., Ltd.
- Current Assignee Address: TW Hsinchu
- Agency: J.C. PATENTS
- Main IPC: G11C7/18
- IPC: G11C7/18

Abstract:
A three-dimensional memory structure is provided and including a memory array, including a first and a second sub-arrays, each having a first selection line, plural word lines, and a second selection line; a connection structure, including plural connection areas, and at least one of extension structures of the first selection line, the plural of word lines, and the second selection line is coupled to a corresponding connection area of the plurality of connection areas; a pass gate set, arranged under the connection structure and between the first and the second sub-arrays, the pass gate set including plural pass gates, and, the word lines and the second selection line, and the pass gates are respectively coupled to the corresponding connection areas; and a drive circuit, coupled to the pass gate set, and disposed under the connection structure.
Public/Granted literature
- US20230290392A1 3D MEMORY STRUCTURE AND CIRCUIT Public/Granted day:2023-09-14
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