Invention Grant
- Patent Title: Methods for filling a gap and related systems and devices
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Application No.: US17530691Application Date: 2021-11-19
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Publication No.: US12094769B2Publication Date: 2024-09-17
- Inventor: Zecheng Liu , Viljami Pore , Jia Li Yao , René Henricus Jozef Vervuurt
- Applicant: ASM IP Holding B.V.
- Applicant Address: NL Almere
- Assignee: ASM IP Holding B.V.
- Current Assignee: ASM IP Holding B.V.
- Current Assignee Address: NL Almere
- Agency: Snell & Wilmer L.L.P.
- Main IPC: H01L21/02
- IPC: H01L21/02 ; H01J37/32 ; H01L21/3065 ; H01L21/768

Abstract:
Methods and related systems for filling a gap feature comprised in a substrate are disclosed. The methods comprise a step of providing a substrate comprising one or more gap features into a reaction chamber. The one or more gap features comprise an upper part comprising an upper surface and a lower part comprising a lower surface. The methods further comprise a step of subjecting the substrate to a first plasma treatment and subjecting the substrate to a second plasma treatment. Thus the upper surface is inhibited while leaving the lower surface substantially unaffected. Then, the methods comprise a step of selectively depositing a material on the lower surface.
Public/Granted literature
- US20220165615A1 METHODS FOR FILLING A GAP AND RELATED SYSTEMS AND DEVICES Public/Granted day:2022-05-26
Information query
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