Invention Grant
- Patent Title: Light emitting element assembly, multi-beam laser chip assembly and stereolithographic apparatus, and member assembly and method for manufacturing the same
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Application No.: US17427955Application Date: 2020-01-17
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Publication No.: US12095224B2Publication Date: 2024-09-17
- Inventor: Kei Satou , Jugo Mitomo
- Applicant: Sony Group Corporation
- Applicant Address: JP Tokyo
- Assignee: Sony Group Corporation
- Current Assignee: Sony Group Corporation
- Current Assignee Address: JP Tokyo
- Agency: K&L Gates LLP
- Priority: JP 19018808 2019.02.05
- International Application: PCT/JP2020/001493 2020.01.17
- International Announcement: WO2020/162142A 2020.08.13
- Date entered country: 2021-08-03
- Main IPC: H01S5/0237
- IPC: H01S5/0237 ; H01L33/48 ; H01S5/02253 ; H01S5/42

Abstract:
A light emitting element assembly includes: a light emitting element (21); a light emitting element drive unit (30); a first joining member (41) connected to an electrode provided in the light emitting element (21); and a second joining member (42) provided on the light emitting element drive unit (30). In the light emitting element assembly, one of the first joining member (41) and the second joining member (42) includes an alloy material, the other one of the first joining member (41) and the second joining member (42) includes a metallic material, the joining member (the second joining member (42)) including the alloy material includes a first portion (43) and a second portion (44), the joining member (the first joining member (41)) including the metallic material and the first portion (43) are joined to each other, and the second portion (44) is provided on the light emitting element drive unit (30) between the light emitting element (21) and the light emitting element drive unit (30), and is in contact with the light emitting element (21).
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