Invention Grant
- Patent Title: Deposition ring for thin substrate handling via edge clamping
-
Application No.: US16951805Application Date: 2020-11-18
-
Publication No.: US12100579B2Publication Date: 2024-09-24
- Inventor: Abhishek Chowdhury , Edwin C. Suarez , Harisha Sathyanarayana , Nataraj Bhaskar Rao , Siqing Lu
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: MOSER TABOA
- Main IPC: H01J37/32
- IPC: H01J37/32 ; C23C14/00 ; C23C14/34 ; C23C14/35 ; C23C14/50 ; C23C16/458

Abstract:
Embodiments of process kits for use in a process chamber are provided herein. In some embodiments, a process kit for use in a process chamber includes: a deposition ring including a first portion having an first inner ledge and a second portion having a second inner ledge, wherein in a first position, the first portion is spaced from the second portion, and wherein in a second position, the second portion is configured to engage the first portion so that the first inner ledge is aligned with the second inner ledge along a common plane to form a clamping surface.
Public/Granted literature
- US20220157572A1 DEPOSITION RING FOR THIN SUBSTRATE HANDLING VIA EDGE CLAMPING Public/Granted day:2022-05-19
Information query