- 专利标题: Electrical wire processing device
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申请号: US17311710申请日: 2019-11-26
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公开(公告)号: US12100941B2公开(公告)日: 2024-09-24
- 发明人: Masaru Hisano , Mitsuhiko Tsuda
- 申请人: Shinmaywa Industries, Ltd.
- 申请人地址: JP Takarazuka
- 专利权人: SHINMAYWA INDUSTRIES, LTD.
- 当前专利权人: SHINMAYWA INDUSTRIES, LTD.
- 当前专利权人地址: JP Hyogo
- 代理机构: Keating & Bennett, LLP
- 优先权: JP 18231920 2018.12.11
- 国际申请: PCT/JP2019/046172 2019.11.26
- 国际公布: WO2020/121803A 2020.06.18
- 进入国家日期: 2021-06-08
- 主分类号: H02G1/12
- IPC分类号: H02G1/12 ; B26D3/08
摘要:
An electrical wire processing device (1) includes a pair of cutting blades (40A, 40B) capable of cutting an electrical wire (5) and circumferentially notching a covering (5b), a slit blade (43A, 43B) disposed farther in one side in a longitudinal direction (CL) of the electrical wire (5) than the cutting blades (40A, 40B) and capable of slitting the covering (5b) in the longitudinal direction (CL) of the electrical wire (5), and a slit blade actuator (35A, 35B) that moves the slit blade (43A, 43B) between a slit position in which the slit blade (43A, 43B) comes closer to the electrical wire (5) than the cutting blades (40A, 40B) and a retraction position in which the slit blade (43A, 43B) goes farther from the electrical wire (5) than the cutting blades (40A, 40B).
公开/授权文献
- US20220029394A1 ELECTRICAL WIRE PROCESSING DEVICE 公开/授权日:2022-01-27
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