Invention Grant
- Patent Title: Speaker module mounting structure and electronic device including the same
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Application No.: US17726770Application Date: 2022-04-22
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Publication No.: US12101585B2Publication Date: 2024-09-24
- Inventor: Donghyun Kim , Youngbae Park , Juyoung Yu , Nammin Jo , Joonrae Cho
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR Suwon-si
- Agency: Cha & Reiter, LLC
- Priority: KR 20210052454 2021.04.22
- Main IPC: H04R1/02
- IPC: H04R1/02 ; G02C11/00 ; H04R1/10

Abstract:
According to certain embodiments, an apparatus comprises: an upper case facing a first direction; a lower case facing a second direction opposite to the first direction, the lower case coupled to the upper case, thereby forming an internal space; a speaker module disposed in the internal space, wherein the speaker module includes: a speaker; a bracket surrounding at least a part of the speaker, the bracket comprising: a first opening positioned to receive sound generated from the speaker; at least one first part coupled with the upper case; and at least one second part coupled with the lower case; at least one first sealing member disposed on the at least one first part of the bracket and sealing the bracket and the upper case; and a second sealing member disposed on the at least one second part of the bracket and sealing the bracket and the lower case.
Public/Granted literature
- US20220345802A1 SPEAKER MODULE MOUNTING STRUCTURE AND ELECTRONIC DEVICE INCLUDING THE SAME Public/Granted day:2022-10-27
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