Invention Grant
- Patent Title: Circuit board assembly
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Application No.: US18455782Application Date: 2023-08-25
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Publication No.: US12101881B2Publication Date: 2024-09-24
- Inventor: Ching-Ho Hsieh , Ming-Hsing Wu , Kuei-Sheng Wu
- Applicant: Unimicron Technology Corporation
- Applicant Address: TW Taoyuan
- Assignee: Unimicron Technology Corporation
- Current Assignee: Unimicron Technology Corporation
- Current Assignee Address: TW Taoyuan
- Agency: Best & Flanagan LLP
- Priority: TW 0138172 2021.10.14
- The original application number of the division: US17529410 2021.11.18
- Main IPC: H05K1/14
- IPC: H05K1/14 ; H01R12/79 ; H05K1/02

Abstract:
A circuit board assembly is provided and includes a first circuit board, a second circuit board and a first connecting module. The first connecting module includes a first connecting wire, a first connector and a second connector. The first circuit board includes a first processor, and the second circuit board includes a second processor. One end of the first connector is connected to one end of the first connecting wire, and the other end of the first connector is connected to the first circuit board. One end of the second connector is connected to the other end of the first connecting wire, and the other end of the second connector is connected to the second circuit board. The first connector is adjacent to the first processor, and the second connector is adjacent to the second processor.
Public/Granted literature
- US20230413441A1 CIRCUIT BOARD ASSEMBLY Public/Granted day:2023-12-21
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