Invention Grant
- Patent Title: Switch sub-chassis systems and methods
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Application No.: US16948726Application Date: 2020-09-30
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Publication No.: US12105330B2Publication Date: 2024-10-01
- Inventor: Kevin Leigh , Everett Salinas , John Franz
- Applicant: Hewlett Packard Enterprise Development LP
- Applicant Address: US TX Houston
- Assignee: Hewlett Packard Enterprise Development LP
- Current Assignee: Hewlett Packard Enterprise Development LP
- Current Assignee Address: US TX Spring
- Agency: Hewlett Packard Enterprise Patent Department
- The original application number of the division: US16192445 2018.11.15
- Main IPC: G02B6/38
- IPC: G02B6/38 ; G02B6/44 ; H01R12/70 ; H05K7/14

Abstract:
Switch sub-chassis systems and methods for rack-scale servers are disclosed. A switch sub-chassis is arranged for modular installation in an enclosure and includes structural support features that allow multiple hot-serviceable line-cards and an integrated high-density optical fiber connectivity within the sub-chassis. Various features of the switch sub-chassis and associated line-cards allow liquid-electro-optical blindmate of the line-cards so that the line-cards are serviceable, allow high-density and complex fiber shuffle assemblies support, and facilitate ease of installation and/or servicing of fiber assemblies.
Public/Granted literature
- US20210088735A1 SWITCH SUB-CHASSIS SYSTEMS AND METHODS Public/Granted day:2021-03-25
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