Invention Grant
- Patent Title: Fingerprint sensing device
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Application No.: US17355202Application Date: 2021-06-23
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Publication No.: US12106598B2Publication Date: 2024-10-01
- Inventor: Shu-Wen Tzeng , Yan-Liang Chen , Jui-Chi Lo
- Applicant: Au Optronics Corporation
- Applicant Address: TW Hsinchu
- Assignee: Au Optronics Corporation
- Current Assignee: Au Optronics Corporation
- Current Assignee Address: TW Hsinchu
- Agency: JCIPRNET
- Priority: TW 0102833 2021.01.26
- Main IPC: G06V40/13
- IPC: G06V40/13 ; H10K59/124 ; H10K59/131 ; H10K59/40

Abstract:
A fingerprint sensing device has a sensing area, an operation area, and a peripheral area, and the operation area is disposed between the sensing area and the peripheral area. The fingerprint sensing device includes a substrate, a sensing element located at the sensing area, an operation element located at the operation area, a first signal line located at the peripheral area, a first planarization layer, a first insulating layer, and a first shading layer. The first planarization layer is located on the substrate and has a first trench, and the first trench overlaps the first signal line. The first insulating layer is located on the first planarization layer and in the first trench, and the first insulating layer has a first opening located in the first trench. The first shading layer is located on the first insulating layer and connected to the first signal line through the first opening.
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