Invention Grant
- Patent Title: System-in-package chip of printer driver system
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Application No.: US17559025Application Date: 2021-12-22
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Publication No.: US12107071B2Publication Date: 2024-10-01
- Inventor: Hao-Jan Mou , Ching-Sung Lin , Yung-Lung Han , Chi-Feng Huang , Chin-Wen Hsieh , Tsung-I Lin
- Applicant: MICROJET TECHNOLOGY CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: MICROJET TECHNOLOGY CO., LTD.
- Current Assignee: MICROJET TECHNOLOGY CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: Birch, Stewart, Kolasch & Birch, LLP
- Priority: TW 0100487 2021.01.06
- Main IPC: H01L23/498
- IPC: H01L23/498 ; H01L23/00 ; H01L25/00 ; H01L25/065

Abstract:
A system-in-package chip of printer driver system applicable in a printer includes a first chip, a second chip, and a third chip. The first chip, the second chip, and the third chip are arranged in a common package. The first chip and the second chip are arranged side-by-side on a carrier in the common package. The third chip is arranged on a top portion of the first chip in the common package. A wire carrier structure is formed on the top portion of the first chip before the third chip is disposed on the first chip.
Public/Granted literature
- US20220216181A1 SYSTEM-IN-PACKAGE CHIP OF PRINTER DRIVER SYSTEM Public/Granted day:2022-07-07
Information query
IPC分类: