Invention Grant
- Patent Title: Coil including structure for minimizing influence thereon by metal material and resonant circuit including same
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Application No.: US17667964Application Date: 2022-02-09
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Publication No.: US12107442B2Publication Date: 2024-10-01
- Inventor: Jaehyun Park , Beomwoo Gu , Jaeseok Park , Sungku Yeo , Youngho Ryu , Bohwan Choi
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Gyeonggi-do
- Assignee: Samsung Electronics Co., Ltd
- Current Assignee: Samsung Electronics Co., Ltd
- Current Assignee Address: KR
- Agency: The Farrell Law Firm, P.C.
- Priority: KR 20210018413 2021.02.09
- Main IPC: H02J50/70
- IPC: H02J50/70 ; H01F27/26 ; H02J7/02 ; H02J50/12

Abstract:
Disclosed is a coil including a first conductor disposed on a first plane, a second conductor disposed on a second plane different from the first plane, and including a first end electrically connected to a first end of the first conductor, and a second end positioned near a second end of the first conductor, and a third conductor disposed on the first plane, and including a first end electrically connected to the second end of the second conductor, and a second end positioned near the first end of the second conductor, wherein a pattern of the first conductor connecting the first end of the first conductor from the second end of the first conductor is in a clockwise or counterclockwise direction when the first plane is viewed from a first side, and wherein a pattern of the third conductor connecting the second end of the third conductor from the first end of the third conductor is in a direction opposite to the direction of the pattern of the first conductor when the first plane is viewed from the first side.
Public/Granted literature
Information query