Invention Grant
- Patent Title: Wiring circuit board
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Application No.: US17798810Application Date: 2020-11-12
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Publication No.: US12108529B2Publication Date: 2024-10-01
- Inventor: Yoshito Fujimura
- Applicant: NITTO DENKO CORPORATION
- Applicant Address: JP Osaka
- Assignee: NITTO DENKO CORPORATION
- Current Assignee: NITTO DENKO CORPORATION
- Current Assignee Address: JP Osaka
- Agency: Edwards Neils LLC
- Agent Jean C. Edwards, Esq.
- Priority: JP 20024024 2020.02.17
- International Application: PCT/JP2020/042346 2020.11.12
- International Announcement: WO2021/166340A 2021.08.26
- Date entered country: 2022-08-10
- Main IPC: H05K1/02
- IPC: H05K1/02 ; G11B5/48 ; G11B5/49 ; H05K1/05 ; H05K1/11 ; H05K3/28 ; H05K3/44

Abstract:
A suspension board with circuit including a first mounting region for mounting a slider and a second mounting region for mounting a piezoelectric element. The wiring circuit board includes a metal support layer, a base insulating layer, and a conductive layer. The conductive layer includes a first wiring pattern, a second wiring pattern, and a shield wiring pattern. The first wiring pattern includes a read wiring. The second wiring pattern includes a power supply wiring disposed at spaced intervals to the read wiring. The shield wiring pattern includes a shield wiring disposed between the read wiring and the power supply wiring.
Public/Granted literature
- US20230156914A1 WIRING CIRCUIT BOARD Public/Granted day:2023-05-18
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