Invention Grant
- Patent Title: Space filling material and space filling structure, and methods for using those
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Application No.: US17464744Application Date: 2021-09-02
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Publication No.: US12109742B2Publication Date: 2024-10-08
- Inventor: Satoshi Katsuya , Ryokei Endo , Yosuke Washitake , Shunsuke Suiko
- Applicant: KURARAY CO., LTD.
- Applicant Address: JP Kurashiki
- Assignee: KURARAY CO., LTD.
- Current Assignee: KURARAY CO., LTD.
- Current Assignee Address: JP Kurashiki
- Agency: Element IP, PLC
- Priority: JP 19046240 2019.03.13
- Main IPC: B32B7/02
- IPC: B32B7/02 ; B29C44/34 ; D04H1/488 ; C08L101/12

Abstract:
Provided are a space filling material and a space filling structure capable of filling a predetermined space for various purposes, and method for using those. A space filling material (11) includes reinforcing fibers as an expansion material and a resin. The reinforcing fibers form a plurality of intersections and are bonded with the resin at at least one of the intersections. Heating of the space filling material causes an expansion stress in at least a thickness direction (X) such that the space filling material fills a predetermined space (13). For example, the space filling material may contain the resin at a volume ratio of 15 to 95 vol % based on a total volume of the reinforcing fibers and the resin.
Public/Granted literature
- US20210394406A1 SPACE FILLING MATERIAL AND SPACE FILLING STRUCTURE, AND METHODS FOR USING THOSE Public/Granted day:2021-12-23
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