Invention Grant
- Patent Title: Dimensional compensations for additive manufacturing
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Application No.: US17426580Application Date: 2019-04-30
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Publication No.: US12109762B2Publication Date: 2024-10-08
- Inventor: Sergio Gonzalez Martin , Manuel Freire Garcia , Ismael Fernandez Aymerich
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Spring
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Spring
- Agent Michael Dryja
- International Application: PCT/US2019/029833 2019.04.30
- International Announcement: WO2020/222786A 2020.11.05
- Date entered country: 2021-07-28
- Main IPC: B29C64/00
- IPC: B29C64/00 ; B29C64/393 ; B33Y50/02

Abstract:
In an example, a method includes receiving, at least one processor, object model data representing at least a portion of a first object that is to be generated by an additive manufacturing apparatus by fusing build material within a fabrication chamber. An indication of an amount of fused build material in a region of the fabrication chamber which is to be below the region in which the first object is to be generated may be determined and a dimensional compensation value to apply to the object model data representing the first object may be determined based on the determined indication. The determined dimensional compensation value may be applied to the object model data to derive modified object model data.
Public/Granted literature
- US20220161498A1 DIMENSIONAL COMPENSATIONS FOR ADDITIVE MANUFACTURING Public/Granted day:2022-05-26
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