Invention Grant
- Patent Title: Inductor component and inductor component mounting substrate
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Application No.: US18523280Application Date: 2023-11-29
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Publication No.: US12112881B2Publication Date: 2024-10-08
- Inventor: Rikiya Sano , Masayuki Yoneda
- Applicant: Murata Manufacturing Co., Ltd.
- Applicant Address: JP Kyoto-fu
- Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee: Murata Manufacturing Co., Ltd.
- Current Assignee Address: JP Kyoto-fu
- Agency: Studebaker & Brackett PC
- Priority: JP 20180534 2020.10.28
- Main IPC: H01F27/29
- IPC: H01F27/29 ; H01F27/28 ; H05K1/18

Abstract:
An inductor component includes a component body having a mounting surface and a top surface and provided therein with a spiral inductor wiring line advancing in the extending direction of a winding center axis. The inductor wiring line is connected to a first external electrode at a first end, and connected to a second external electrode at a second end. The component body includes: a first inclined surface connected to a first end of the mounting surface on a first side in a length direction and inclined toward the top surface as separating from the first end; and a second inclined surface connected to a second end of the mounting surface on a second side in the length direction and inclined toward the top surface as separating from the second end. The winding center axis extends in a direction parallel to the mounting surface and perpendicular to the length direction.
Public/Granted literature
- US20240096545A1 INDUCTOR COMPONENT AND INDUCTOR COMPONENT MOUNTING SUBSTRATE Public/Granted day:2024-03-21
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