Invention Grant
- Patent Title: Integrated circuit device
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Application No.: US17472926Application Date: 2021-09-13
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Publication No.: US12113108B2Publication Date: 2024-10-08
- Inventor: Dohee Kim , Gyeom Kim , Jinbum Kim , Haejun Yu , Kyungin Choi , Kihyun Hwang , Seunghun Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel, P.A.
- Priority: KR 20210016282 2021.02.04
- Main IPC: H01L29/41
- IPC: H01L29/41 ; H01L27/088 ; H01L29/417

Abstract:
An integrated circuit device includes a plurality of gate structures each including a gate line extending on a fin-type active region and insulation spacers on sidewalls of the gate line; a source/drain contact between first and second gate structures, and having opposing sides that are asymmetric in the first horizontal direction; and an insulation liner on sidewalls of the source/drain contact. The source/drain contact includes a lower contact portion and an upper contact portion having a horizontal extension that extends on an upper corner of the first gate structure, the insulation liner includes a first local region between the upper corner and the horizontal extension and a second local region that is farther from the substrate than the first local region, and a thickness of the first local region is greater than that of the second local region.
Public/Granted literature
- US20220246738A1 INTEGRATED CIRCUIT DEVICE Public/Granted day:2022-08-04
Information query
IPC分类: